上海原裝進口松下芯片倒裝底填膠CV5300AK01EPS

CV5300AK

TECHNICAL INFORMATION

Encapsulation Materials Department Plastic Materials Business Unit Electronic Materials Business Division

Panasonic Industory Co., Ltd

This is one component epoxy for Flip-chip underfilling.

TYPICAL PROPERTIES

Properties

Unit

Data

Test Method

Viscosity(25oC)

Pa*s

20

KES-B-0102

Gelation time

sec

800

EKS-B-1051

RECOMMENDING PREHEAT CONDITION

temperature of substrate : 80～120oC

temperature of syringe : R.T.～ 60oC

TYPICAL CURED PROPERTIES

Measurement Cure Conditions : 100'C2hour + 150`C 2hour

?Stored compound must be thawed before use. Warm at room temperature until no longer cool to touch (about 2hrs).

?Please use up the material within 12 hrs.

?Compound must be stored in the cool condition with sealing.

?Please keep material under -40oC after receiving product.

ATTENTION TO HANDLING

?Please avoid direct contact with this product by wearing gloves, protecting gears,etc.

?Prevent frequent skin contact. If contact occurs, wash immediately with soap and water.

上海原裝進口松下芯片倒裝底填膠CV5300AK01EPS

上海金泰諾材料科技有限公司是由在膠粘劑行業(yè)擁有10余年從業(yè)經驗的專YE人士創(chuàng)立，是一家專為電子、工業(yè)等制造領域客戶提供膠粘劑解決方案的供應商。我們與國內外知MING品牌膠粘劑廠家合作，組建了一支專YE的銷售及技術團隊,只為在進口品牌替代、國外特殊產品引進以及產品的選擇、應用及售后技術支持等方面，為您提供更精ZHUN、更專YE、更高XIAO的服務。

公司主要致力于為LED照明、家用電器、消費電子、集成電路封裝、光通信、新能源電池、汽車零部件、電源模塊、風電、AR眼鏡、智能水表、電機等行業(yè)用膠方案的提供。在膠粘劑方面，公司注重新材料的開發(fā)和應用，不斷提升用膠產品的品質和性能，提高國內生產型企業(yè)產品在國內國際市場的競爭力。積極配合和制定相關產品的粘結方案，解決行業(yè)內產品用膠難點的突破。